Photo of Mervyn Armstrong
  • Room 08.006 - Ashby Tower

    United Kingdom


Research output per year

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Research Output

Conference contribution

Fabrication of Sub-micron Active Layer SSOI Substrates using Ion Splitting and Wafer Bonding Technologies

Ruddell, F., Bain, M., Suder, S., Hurley, R., Armstrong, M., Fusco, V. & Gamble, H., Sep 2003, SEMICONDUCTOR WAFER BONDING VII: SCIENCE, TECHNOLOGY, AND APPLICATIONS, PROCEEDINGS. Vol. 2003. p. 25-30 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)