A comparative study into surface electromigration of sputtered copper patterned using lift-off and CMP

N.D. McCusker, V.S.C. Len, B.H.W. Toh, David McNeill, Harold Gamble

Research output: Contribution to conferencePaper

LanguageEnglish
Pages93-96
Number of pages4
Publication statusPublished - Oct 2000
EventProceedings of 3rd International Conference on Materials for Microelectronics - Dublin, Ireland
Duration: 01 Oct 200001 Oct 2000

Conference

ConferenceProceedings of 3rd International Conference on Materials for Microelectronics
CountryIreland
CityDublin
Period01/10/200001/10/2000

Cite this

McCusker, N. D., Len, V. S. C., Toh, B. H. W., McNeill, D., & Gamble, H. (2000). A comparative study into surface electromigration of sputtered copper patterned using lift-off and CMP. 93-96. Paper presented at Proceedings of 3rd International Conference on Materials for Microelectronics, Dublin, Ireland.
McCusker, N.D. ; Len, V.S.C. ; Toh, B.H.W. ; McNeill, David ; Gamble, Harold. / A comparative study into surface electromigration of sputtered copper patterned using lift-off and CMP. Paper presented at Proceedings of 3rd International Conference on Materials for Microelectronics, Dublin, Ireland.4 p.
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note = "Proceedings of 3rd International Conference on Materials for Microelectronics ; Conference date: 01-10-2000 Through 01-10-2000",

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McCusker, ND, Len, VSC, Toh, BHW, McNeill, D & Gamble, H 2000, 'A comparative study into surface electromigration of sputtered copper patterned using lift-off and CMP' Paper presented at Proceedings of 3rd International Conference on Materials for Microelectronics, Dublin, Ireland, 01/10/2000 - 01/10/2000, pp. 93-96.

A comparative study into surface electromigration of sputtered copper patterned using lift-off and CMP. / McCusker, N.D.; Len, V.S.C.; Toh, B.H.W.; McNeill, David; Gamble, Harold.

2000. 93-96 Paper presented at Proceedings of 3rd International Conference on Materials for Microelectronics, Dublin, Ireland.

Research output: Contribution to conferencePaper

TY - CONF

T1 - A comparative study into surface electromigration of sputtered copper patterned using lift-off and CMP

AU - McCusker, N.D.

AU - Len, V.S.C.

AU - Toh, B.H.W.

AU - McNeill, David

AU - Gamble, Harold

PY - 2000/10

Y1 - 2000/10

M3 - Paper

SP - 93

EP - 96

ER -

McCusker ND, Len VSC, Toh BHW, McNeill D, Gamble H. A comparative study into surface electromigration of sputtered copper patterned using lift-off and CMP. 2000. Paper presented at Proceedings of 3rd International Conference on Materials for Microelectronics, Dublin, Ireland.