A comparative study into surface electromigration of sputtered copper patterned using lift-off and CMP

N.D. McCusker, V.S.C. Len, B.H.W. Toh, David McNeill, Harold Gamble

Research output: Contribution to conferencePaper

Original languageEnglish
Pages93-96
Number of pages4
Publication statusPublished - Oct 2000
EventProceedings of 3rd International Conference on Materials for Microelectronics - Dublin, Ireland
Duration: 01 Oct 200001 Oct 2000

Conference

ConferenceProceedings of 3rd International Conference on Materials for Microelectronics
CountryIreland
CityDublin
Period01/10/200001/10/2000

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