A novel combined correlation power analysis (CPA) attack on schoolbook polynomial multiplication in lattice-based cryptosystems

Chuanchao Lu, Yijun Cui, Ayesha Khalid, Chongyan Gu, Chenghua Wang, Weiqiang Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
44 Downloads (Pure)

Abstract

The lattice-based cryptography problems are known to be secure against the quantum computing attacks, till date no known quantum algorithm is able to solve these hard problems in lattices. Their naive implementations on embedded devices are, however, vulnerable to side-channel analysis (SCA) attacks with full key recovery possible via power/EM leakage analysis. This work analyses and attacks the power side channel leakage in the baseline hardware architecture of schoolbook polynomial multiplication, that is an essential component of most of the lattice based cryptography implementations. We first undertake a horizontal correlation power analysis (HCPA) method, optimized to work independent of the precise attack location specification in the schoolbook polynomial multiplier power leakage profile. Inspite of the inherent difficulties in HCPA, the attack is extremely efficient; with an 99.90% accuracy of recovering any one sub secret-key using only a single trace. Next we undertake the vertical correlation power analysis (VCPA) attack on the schoolbook polynomial multiplier power leakage profile, that requires larger number of power traces to analyze the correlation. Finally, we propose a novel combined correlation power analysis (CCPA) method that combines the strengths of both the VCPA and the HCPA to further improve the attacking capability of HCPA. We report a complete secret key recovery with a 100% accuracy by using only 4 power traces.

Original languageEnglish
Title of host publicationProceedings: 2022 IEEE 35th International System-on-Chip Conference, SOCC 2022
EditorsSakir Sezer, Thomas Buchner, Jurgen Becker, Andrew Marshall, Fahad Siddiqui, Tanja Harbaum, Kieran McLaughlin
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages6
ISBN (Electronic)9781665459853
DOIs
Publication statusPublished - 10 Oct 2022
Event35th IEEE International System-on-Chip Conference, SOCC 2022 - Belfast, Northern Ireland, United Kingdom
Duration: 05 Sept 202208 Sept 2022

Publication series

NameInternational System on Chip Conference
Volume2022-September
ISSN (Print)2164-1676
ISSN (Electronic)2164-1706

Conference

Conference35th IEEE International System-on-Chip Conference, SOCC 2022
Country/TerritoryUnited Kingdom
CityBelfast, Northern Ireland
Period05/09/202208/09/2022

Bibliographical note

Funding Information:
This work is supported by grants from National Natural Science Foundation of China (62022041 62134002 62104107), Natural Science Foundation of Jiangsu Province (BK20210287), the Royal Society Research Grant IEC/ NSFC/211024 and EPSRC Quantum Communications Hub (EP/T001011/1).

Publisher Copyright:
© 2022 IEEE.

Keywords

  • Correlation power analysis
  • Horizontal CPA (HCPA)
  • Lattice-based cryptography
  • Ring-LWE
  • School-book polynomial multiplier
  • Side-channel analysis

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'A novel combined correlation power analysis (CPA) attack on schoolbook polynomial multiplication in lattice-based cryptosystems'. Together they form a unique fingerprint.

Cite this