Advanced microwave oven for rapid curing of encapsulant

K.I. Sinclair, T. Tilford, George Goussetis, C. Bailey, M.P.Y. Desmulliez, A.K. Parrott, A.J. Sangster

Research output: Contribution to conference › Paper

Original language	English
Pages	551-556
Number of pages	6
Publication status	Published - Sept 2008
Event	2nd Electronics System-Integration Technology Conference - Greenwich, England, United Kingdom Duration: 01 Sept 2008 → 01 Sept 2008

Conference	2nd Electronics System-Integration Technology Conference
Country/Territory	United Kingdom
City	Greenwich, England
Period	01/09/2008 → 01/09/2008

Cite this

@conference{47c2cf9b5e844440a7cb29fc3efd4f53,

title = "Advanced microwave oven for rapid curing of encapsulant",

author = "K.I. Sinclair and T. Tilford and George Goussetis and C. Bailey and M.P.Y. Desmulliez and A.K. Parrott and A.J. Sangster",

year = "2008",

month = sep,

language = "English",

pages = "551--556",

note = "2nd Electronics System-Integration Technology Conference ; Conference date: 01-09-2008 Through 01-09-2008",

}

TY - CONF

T1 - Advanced microwave oven for rapid curing of encapsulant

AU - Sinclair, K.I.

AU - Tilford, T.

AU - Goussetis, George

AU - Bailey, C.

AU - Desmulliez, M.P.Y.

AU - Parrott, A.K.

AU - Sangster, A.J.

PY - 2008/9

Y1 - 2008/9

UR - http://www.scopus.com/inward/record.url?scp=58149095068&partnerID=8YFLogxK

M3 - Paper

SP - 551

EP - 556

T2 - 2nd Electronics System-Integration Technology Conference

Y2 - 1 September 2008 through 1 September 2008

ER -