AN ADSORBATE-STABILIZED VACANCY STRUCTURE FOR CU ON W(100) - A SURFACE ALLOY

P HU*, A WANDER, LM DELAGARZA, MP BESSENT, DA KING

*Corresponding author for this work

Research output: Contribution to journalLetter

Abstract

Deposition of 0.5 ML of Cu on W(100) leads to the formation of a sharp c(2 x 2) structure when the surface is annealed at 800 K. A LEED intensity analysis reveals that the Cu atoms are adsorbed displacively into W sites, forming an ordered 2D surface alloy. Due to the lattice mismatch between copper and tungsten, a substantial buckling of the first layer of the alloy is also observed. The clean, bulk terminated W(100) surface is only just stable relative to the c(2 x 2) vacancy covered W(100) surface. This relative stability of the vacancy structure explains the driving force behind the formation of this alloy.

Original languageEnglish
Pages (from-to)L542-L546
Number of pages5
JournalSurface Science
Volume286
Issue number1-2
Publication statusPublished - 20 Apr 1993

Keywords

  • ENERGY-ELECTRON DIFFRACTION
  • RECONSTRUCTION
  • LEED
  • CONDENSATION
  • TRANSITION
  • MO(100)
  • COPPER
  • SILVER
  • GOLD
  • AU

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