Application of atmospheric plasma for low temperature wafer bonding

Y.W. Low, Paul Rainey, Paul Baine, John Montgomery, David McNeill, Neil Mitchell, Harold Gamble, Mervyn Armstrong

Research output: Contribution to journalArticle

2 Citations (Scopus)
Original languageEnglish
Pages (from-to)385-393
Number of pages9
JournalECS Transactions
Volume28(1)
Publication statusPublished - Apr 2010

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