Atmospheric-pressure plasma activation for low temperature bonding

Research output: Contribution to conference › Paper

Original language	English
Pages	0-0
Number of pages	1
Publication status	Published - Oct 2010
Event	218th ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications - Las Vegas, United States Duration: 01 Oct 2010 → 01 Oct 2010

Conference	218th ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications
Country	United States
City	Las Vegas
Period	01/10/2010 → 01/10/2010

Cite this

@conference{9d7adce21131455883d7ba0962af5822,

title = "Atmospheric-pressure plasma activation for low temperature bonding",

author = "Y.W. Low and Paul Rainey and Paul Baine and John Montgomery and Neil Mitchell and David McNeill and Harold Gamble and Mervyn Armstrong",

year = "2010",

month = oct,

language = "English",

pages = "0--0",

note = "218th ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications ; Conference date: 01-10-2010 Through 01-10-2010",

}

2010. 0-0 Paper presented at 218th ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications, Las Vegas, United States.

Research output: Contribution to conference › Paper

TY - CONF

T1 - Atmospheric-pressure plasma activation for low temperature bonding

AU - Low, Y.W.

AU - Rainey, Paul

AU - Baine, Paul

AU - Montgomery, John

AU - Mitchell, Neil

AU - McNeill, David

AU - Gamble, Harold

AU - Armstrong, Mervyn

PY - 2010/10

Y1 - 2010/10

M3 - Paper

SP - 0

EP - 0

T2 - 218th ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications

Y2 - 1 October 2010 through 1 October 2010

ER -