Atmospheric-pressure plasma activation for low temperature bonding

Y.W. Low, Paul Rainey, Paul Baine, John Montgomery, Neil Mitchell, David McNeill, Harold Gamble, Mervyn Armstrong

Research output: Contribution to conferencePaper

Original languageEnglish
Pages0-0
Number of pages1
Publication statusPublished - Oct 2010
Event218th ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications - Las Vegas, United States
Duration: 01 Oct 201001 Oct 2010

Conference

Conference218th ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications
CountryUnited States
CityLas Vegas
Period01/10/201001/10/2010

Cite this

Low, Y. W., Rainey, P., Baine, P., Montgomery, J., Mitchell, N., McNeill, D., Gamble, H., & Armstrong, M. (2010). Atmospheric-pressure plasma activation for low temperature bonding. 0-0. Paper presented at 218th ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications, Las Vegas, United States.