BESOI using a silicon germanium etch stop

X. Li, D.L. Gay, David McNeill, Mervyn Armstrong, Harold Gamble

Research output: Contribution to conferencePaper

Original languageEnglish
Pages313-320
Number of pages8
Publication statusPublished - Sep 1997
EventProceedings of 192nd ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications IV - Paris, France
Duration: 01 Sep 199701 Sep 1997

Conference

ConferenceProceedings of 192nd ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications IV
CountryFrance
CityParis
Period01/09/199701/09/1997

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