Bond between microwave cured repair and concrete substrate

Konstantinos Grigoriadis, P. S. Mangat, Shahriar Abubakri

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)
215 Downloads (Pure)


The bond strength between a concrete substrate and repair patch is critical to its durability. This paper investigates the effect of microwave curing the freshly applied repair, for 45 min at 132 Watts, on the 28 day bond strength between substrate concrete and different commercial repair materials. The repairs were applied at different ambient temperatures of 20, 10, 2 and −5 °C. Tensile split tests on repaired cube specimens were performed to determine the interfacial bond strength. The ability of microwave curing to prevent the detrimental effects of freezing at early age on the bond and compressive strength of repair patches is investigated. Experimental results show that microwave curing prevents loss of long term (28 day) repair/substrate bond strength of repair materials applied at freezing temperatures (−5 °C), relative to the repairs applied at higher temperatures (2–20 °C), except one lightweight repair formulation. In comparison, the control samples (non-microwave cured) of repairs applied at −5 °C suffered severe loss of bond strength and compressive strength due to early age freezing. In addition, no adverse effects on the bond strength and a small reduction of 6.75% in the 28 day compressive strength are observed in the early age microwave cured repairs applied at ambient temperatures of 2–20 °C. The repair/substrate bond strength is independent of the compressive strength of the repair material at all temperatures of repair application. Microwave curing can accelerate the concrete repair process and facilitate construction activity in cold weather.
Original languageEnglish
Article number125
Number of pages14
JournalRILEM Materials and Structures
Issue number2
Early online date19 Jan 2017
Publication statusPublished - Apr 2017


  • Concrete
  • Patch repair
  • Microwave curing
  • Bond strength
  • Tensile split test


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