Characterisation of copper inductors fabricated on low-k SOG dielectric layers and low resistivity silicon wafers by electroplating techniques

B.H.W. Toh, Daniel Bien, David McNeill, Harold Gamble

Research output: Contribution to conferencePaper

LanguageEnglish
Pages0-0
Number of pages1
Publication statusPublished - Sep 2004
Event28th Annual Microscopical Society of Ireland (MSI) Meeting - Dublin, Ireland
Duration: 01 Sep 200401 Sep 2004

Conference

Conference28th Annual Microscopical Society of Ireland (MSI) Meeting
CountryIreland
CityDublin
Period01/09/200401/09/2004

Cite this

Toh, B. H. W., Bien, D., McNeill, D., & Gamble, H. (2004). Characterisation of copper inductors fabricated on low-k SOG dielectric layers and low resistivity silicon wafers by electroplating techniques. 0-0. Paper presented at 28th Annual Microscopical Society of Ireland (MSI) Meeting, Dublin, Ireland.
Toh, B.H.W. ; Bien, Daniel ; McNeill, David ; Gamble, Harold. / Characterisation of copper inductors fabricated on low-k SOG dielectric layers and low resistivity silicon wafers by electroplating techniques. Paper presented at 28th Annual Microscopical Society of Ireland (MSI) Meeting, Dublin, Ireland.1 p.
@conference{f427f4a1c95143a8badf46506459c778,
title = "Characterisation of copper inductors fabricated on low-k SOG dielectric layers and low resistivity silicon wafers by electroplating techniques",
author = "B.H.W. Toh and Daniel Bien and David McNeill and Harold Gamble",
year = "2004",
month = "9",
language = "English",
pages = "0--0",
note = "28th Annual Microscopical Society of Ireland (MSI) Meeting ; Conference date: 01-09-2004 Through 01-09-2004",

}

Toh, BHW, Bien, D, McNeill, D & Gamble, H 2004, 'Characterisation of copper inductors fabricated on low-k SOG dielectric layers and low resistivity silicon wafers by electroplating techniques' Paper presented at 28th Annual Microscopical Society of Ireland (MSI) Meeting, Dublin, Ireland, 01/09/2004 - 01/09/2004, pp. 0-0.

Characterisation of copper inductors fabricated on low-k SOG dielectric layers and low resistivity silicon wafers by electroplating techniques. / Toh, B.H.W.; Bien, Daniel; McNeill, David; Gamble, Harold.

2004. 0-0 Paper presented at 28th Annual Microscopical Society of Ireland (MSI) Meeting, Dublin, Ireland.

Research output: Contribution to conferencePaper

TY - CONF

T1 - Characterisation of copper inductors fabricated on low-k SOG dielectric layers and low resistivity silicon wafers by electroplating techniques

AU - Toh, B.H.W.

AU - Bien, Daniel

AU - McNeill, David

AU - Gamble, Harold

PY - 2004/9

Y1 - 2004/9

M3 - Paper

SP - 0

EP - 0

ER -

Toh BHW, Bien D, McNeill D, Gamble H. Characterisation of copper inductors fabricated on low-k SOG dielectric layers and low resistivity silicon wafers by electroplating techniques. 2004. Paper presented at 28th Annual Microscopical Society of Ireland (MSI) Meeting, Dublin, Ireland.