Characterisation of copper inductors fabricated on low-k SOG dielectric layers and low resistivity silicon wafers by electroplating techniques

B.H.W. Toh; Daniel Bien; David McNeill; Harold Gamble

Characterisation of copper inductors fabricated on low-k SOG dielectric layers and low resistivity silicon wafers by electroplating techniques

B.H.W. Toh, Daniel Bien, David McNeill, Harold Gamble

Research output: Contribution to conference › Paper

Original language	English
Pages	0-0
Number of pages	1
Publication status	Published - Sep 2004
Event	28th Annual Microscopical Society of Ireland (MSI) Meeting - Dublin, Ireland Duration: 01 Sep 2004 → 01 Sep 2004

Conference

Conference	28th Annual Microscopical Society of Ireland (MSI) Meeting
Country	Ireland
City	Dublin
Period	01/09/2004 → 01/09/2004

Cite this

@conference{f427f4a1c95143a8badf46506459c778,

title = "Characterisation of copper inductors fabricated on low-k SOG dielectric layers and low resistivity silicon wafers by electroplating techniques",

author = "B.H.W. Toh and Daniel Bien and David McNeill and Harold Gamble",

year = "2004",

month = sep,

language = "English",

pages = "0--0",

note = "28th Annual Microscopical Society of Ireland (MSI) Meeting ; Conference date: 01-09-2004 Through 01-09-2004",

}

TY - CONF

T1 - Characterisation of copper inductors fabricated on low-k SOG dielectric layers and low resistivity silicon wafers by electroplating techniques

AU - Toh, B.H.W.

AU - Bien, Daniel

AU - McNeill, David

AU - Gamble, Harold

PY - 2004/9

Y1 - 2004/9

M3 - Paper

SP - 0

EP - 0

T2 - 28th Annual Microscopical Society of Ireland (MSI) Meeting

Y2 - 1 September 2004 through 1 September 2004

ER -