Characterisation of crystallisation behaviour of electroless Ni-P plating during heating

Z. Guo, K.G. Keong, Wei Sha

Research output: Contribution to conference › Paper

Original language	English
Pages	451-456
Number of pages	6
Publication status	Published - Dec 2002
Event	4th International Symposium on Electronic Materials and Packaging (EMAP2002) - Kaohsiung, Taiwan, Province of China Duration: 01 Dec 2002 → 01 Dec 2002

Conference	4th International Symposium on Electronic Materials and Packaging (EMAP2002)
Country/Territory	Taiwan, Province of China
City	Kaohsiung
Period	01/12/2002 → 01/12/2002

Cite this

@conference{c86f7266222340e99eb204b94d20601a,

title = "Characterisation of crystallisation behaviour of electroless Ni-P plating during heating",

author = "Z. Guo and K.G. Keong and Wei Sha",

year = "2002",

month = dec,

language = "English",

pages = "451--456",

note = "4th International Symposium on Electronic Materials and Packaging (EMAP2002) ; Conference date: 01-12-2002 Through 01-12-2002",

}