Characterisation of crystallisation behaviour of electroless Ni-P plating during heating

Z. Guo, K.G. Keong, Wei Sha

    Research output: Contribution to conferencePaper

    1 Citation (Scopus)
    Original languageEnglish
    Pages451-456
    Number of pages6
    Publication statusPublished - Dec 2002
    Event4th International Symposium on Electronic Materials and Packaging (EMAP2002) - Kaohsiung, Taiwan, Province of China
    Duration: 01 Dec 200201 Dec 2002

    Conference

    Conference4th International Symposium on Electronic Materials and Packaging (EMAP2002)
    CountryTaiwan, Province of China
    CityKaohsiung
    Period01/12/200201/12/2002

    Cite this

    Guo, Z., Keong, K. G., & Sha, W. (2002). Characterisation of crystallisation behaviour of electroless Ni-P plating during heating. 451-456. Paper presented at 4th International Symposium on Electronic Materials and Packaging (EMAP2002), Kaohsiung, Taiwan, Province of China.