Advances in silicon technology have been a key development in the realisation of many telecommunication and signal processing systems. In many cases, the development of application-specific digital signal processing (DSP) chips is the most cost-effective solution and provides the highest performance. Advances made in computer-aided design (CAD) tools and design methodologies now allow designers to develop complex chips within months or even weeks. This paper gives an insight into the challenges and design methodologies of implementing advanced highperformance chips for DSP. In particular, the paper reviews some of the techniques used to develop circuit architectures from high-level descriptions and the tools which are then used to realise silicon layout.
|Number of pages||10|
|Journal||ELECTRONICS & COMMUNICATION ENGINEERING JOURNAL|
|Publication status||Published - Aug 1998|
ASJC Scopus subject areas
- Computer Networks and Communications
- Electrical and Electronic Engineering