Comment on “Influence of additives and the effect of aging in modifying surface topography of electrodeposited copper” [J. Electrochem. Soc., 156, D215 (2009)]

Wei Sha

Comment on “Influence of additives and the effect of aging in modifying surface topography of electrodeposited copper” [J. Electrochem. Soc., 156, D215 (2009)]

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	S6-S7
Number of pages	2
Journal	Journal of the Electrochemical Society
Volume	158
Publication status	Published - 2011

Cite this

@article{2f14fc51b4c64be293e3bb574c3dbf0a,

title = "Comment on “Influence of additives and the effect of aging in modifying surface topography of electrodeposited copper” [J. Electrochem. Soc., 156, D215 (2009)]",

author = "Wei Sha",

year = "2011",

language = "English",

volume = "158",

pages = "S6--S7",

journal = "Journal of the Electrochemical Society",

publisher = "Electrochemical Society, Inc.",

}