Comparison of induced stresses due to electroless versus sputtered copper interconnect technology

P.J. McNally, J. Kanatharana, B.H.W. Toh, David McNeill, T. Tuomi, A.N. Danilewsky, L. Knuuttila, J. Riikonen, J. Toivonen

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)1280-1284
Number of pages5
JournalSemiconductor Science and Technology
Volume19(11)
Issue number11
DOIs
Publication statusPublished - Nov 2004

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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