Conduit diffusion of dopants in tungsten silicide layers

Mervyn Armstrong, Harold Gamble, Michael Bain, Paul Baine, David McNeill

Research output: Contribution to conference › Paper

Original language	English
Pages	65-70
Number of pages	6
Publication status	Published - Mar 2008
Event	Proc IEEE Conference on Microelectronic Test Structures - Edinburgh, United Kingdom Duration: 01 Mar 2008 → 01 Mar 2008

Conference	Proc IEEE Conference on Microelectronic Test Structures
Country	United Kingdom
City	Edinburgh
Period	01/03/2008 → 01/03/2008

Cite this

Armstrong, M., Gamble, H., Bain, M., Baine, P., & McNeill, D. (2008). Conduit diffusion of dopants in tungsten silicide layers. 65-70. Paper presented at Proc IEEE Conference on Microelectronic Test Structures, Edinburgh, United Kingdom.

@conference{760548016edc4c5296cb7219c272dcb3,

title = "Conduit diffusion of dopants in tungsten silicide layers",

author = "Mervyn Armstrong and Harold Gamble and Michael Bain and Paul Baine and David McNeill",

year = "2008",

month = mar,

language = "English",

pages = "65--70",

note = "Proc IEEE Conference on Microelectronic Test Structures ; Conference date: 01-03-2008 Through 01-03-2008",

}