Conduit diffusion of dopants in tungsten silicide layers

Mervyn Armstrong, Harold Gamble, Michael Bain, Paul Baine, David McNeill

Research output: Contribution to conferencePaper

Original languageEnglish
Pages65-70
Number of pages6
Publication statusPublished - Mar 2008
EventProc IEEE Conference on Microelectronic Test Structures - Edinburgh, United Kingdom
Duration: 01 Mar 200801 Mar 2008

Conference

ConferenceProc IEEE Conference on Microelectronic Test Structures
CountryUnited Kingdom
CityEdinburgh
Period01/03/200801/03/2008

Cite this

Armstrong, M., Gamble, H., Bain, M., Baine, P., & McNeill, D. (2008). Conduit diffusion of dopants in tungsten silicide layers. 65-70. Paper presented at Proc IEEE Conference on Microelectronic Test Structures, Edinburgh, United Kingdom.