Copper flip chip bump interconnect technology for microwave subsystems including RF characterization

Meng Seng (Kenn Wong, David Linton

Research output: Contribution to conferencePaper

1 Citation (Scopus)
Original languageEnglish
Pages335-338
Number of pages4
Publication statusPublished - Dec 2000
Event3rd Electronics Packaging Technology Conference - Singapore, Singapore
Duration: 01 Dec 200001 Dec 2000

Conference

Conference3rd Electronics Packaging Technology Conference
Abbreviated titleEPTC 2000
Country/TerritorySingapore
CitySingapore
Period01/12/200001/12/2000

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