Copper flip chip bump interconnect technology for microwave subsystems including RF characterization

Meng Seng (Kenn Wong, David Linton

Research output: Contribution to conference › Paper

Original language	English
Pages	335-338
Number of pages	4
Publication status	Published - Dec 2000
Event	3rd Electronics Packaging Technology Conference - Singapore, Singapore Duration: 01 Dec 2000 → 01 Dec 2000

Conference	3rd Electronics Packaging Technology Conference
Abbreviated title	EPTC 2000
Country/Territory	Singapore
City	Singapore
Period	01/12/2000 → 01/12/2000

Cite this

@conference{cdf488423567430b9d9254bceb842e66,

title = "Copper flip chip bump interconnect technology for microwave subsystems including RF characterization",

author = "Wong, {Meng Seng (Kenn} and David Linton",

year = "2000",

month = dec,

language = "English",

pages = "335--338",

note = "3rd Electronics Packaging Technology Conference, EPTC 2000 ; Conference date: 01-12-2000 Through 01-12-2000",

}