Design and Optimization of Modular Multiplication for SIDH

Chunyang Liu, Jian Ni, Weiqiang Liu*, Zhe Liu, Máire O'Neill

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Recent progress on quantum physics shows that quantum computers may be a reality in the not too distant future. Based on new mathematical hard problems, post-quantum cryptography (PQC) has been studied to make sure the attacks from quantum computers can be resistant. The latest supersingular isogeny Diffie-Hellman (SIDH) key exchange protocol shows promising security properties among various post-quantum cryptosystems. In this paper, we propose an improved modular multiplication algorithm with special primes that can be used in SIDH key exchange protocol. Both software and hardware implementations are provided and compared with original modular multiplication algorithm. The results show that the software results of improved algorithm can be 24% faster than the original software implementation, while the hardware implementation based on the proposed hardware architecture can be 6 times faster than previous hardware implementation.

Original languageEnglish
Title of host publication2018 IEEE International Symposium on Circuits and Systems (ISCAS 2018): Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages5
ISBN (Electronic)9781538648810
DOIs
Publication statusPublished - 04 May 2018
Event2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018 - Florence, Italy
Duration: 27 May 201830 May 2018

Publication series

NameIEEE International Symposium on Circuits and Systems: Proceedings
Volume2018-May
ISSN (Electronic)2379-447X

Conference

Conference2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018
CountryItaly
CityFlorence
Period27/05/201830/05/2018

Keywords

  • modular multiplication
  • Post-quantum cryptography
  • supersingular isogeny Diffie-Hellman (SIDH)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Liu, C., Ni, J., Liu, W., Liu, Z., & O'Neill, M. (2018). Design and Optimization of Modular Multiplication for SIDH. In 2018 IEEE International Symposium on Circuits and Systems (ISCAS 2018): Proceedings (IEEE International Symposium on Circuits and Systems: Proceedings; Vol. 2018-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISCAS.2018.8351082