Effects of copper grain structure on electromigration behaviour

B.H.W. Toh, David McNeill, Harold Gamble

Research output: Contribution to conferencePaper

Original languageEnglish
Pages39-42
Number of pages4
Publication statusPublished - Sep 2001
EventProceedings of 9th International Symposium on Integrated Circuits, Devices & Systems - Singapore, Singapore
Duration: 01 Sep 200101 Sep 2001

Conference

ConferenceProceedings of 9th International Symposium on Integrated Circuits, Devices & Systems
CountrySingapore
CitySingapore
Period01/09/200101/09/2001

Cite this

Toh, B. H. W., McNeill, D., & Gamble, H. (2001). Effects of copper grain structure on electromigration behaviour. 39-42. Paper presented at Proceedings of 9th International Symposium on Integrated Circuits, Devices & Systems, Singapore, Singapore.