Effects of Interface Conditions and Long-Term Stability of Passive Intermodulation Response in Printed Lines

Alexey Shitvov; T. Olsson; J. Francey; Dmitry Zelenchuk; Alexander Schuchinsky; B. El Banna

doi:10.1049/iet-map.2010.0070

Effects of Interface Conditions and Long-Term Stability of Passive Intermodulation Response in Printed Lines

Alexey Shitvov, T. Olsson, J. Francey, Dmitry Zelenchuk, Alexander Schuchinsky, B. El Banna

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

An experimental investigation of the effect of conductor-to-substrate interface on distributed passive intermodulation (PIM) generation in printed microstrip lines has been undertaken using the custom-designed microwave laminates with removed surface bonding layers and with the commercial adhesion promotion applied to the conductor underside. The study of long-term stability of PIM performance of the printed circuits is reported for the first time. The comprehensive measurement results, observations of the selfimprovement of the PIM performance and the effect of panel bending on PIM generation in printed boards with different finishing are presented. A consistent physical interpretation of the observed phenomena is proposed. The results of this study provide new important considerations for the design and characterisation of low-PIM printed circuits.

Original language	English
Pages (from-to)	68-76
Number of pages	9
Journal	IET Microwaves, Antennas and Propagation
Volume	5
Issue number	1
DOIs	https://doi.org/10.1049/iet-map.2010.0070
Publication status	Published - Jan 2011

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title = "Effects of Interface Conditions and Long-Term Stability of Passive Intermodulation Response in Printed Lines",

abstract = "An experimental investigation of the effect of conductor-to-substrate interface on distributed passive intermodulation (PIM) generation in printed microstrip lines has been undertaken using the custom-designed microwave laminates with removed surface bonding layers and with the commercial adhesion promotion applied to the conductor underside. The study of long-term stability of PIM performance of the printed circuits is reported for the first time. The comprehensive measurement results, observations of the selfimprovement of the PIM performance and the effect of panel bending on PIM generation in printed boards with different finishing are presented. A consistent physical interpretation of the observed phenomena is proposed. The results of this study provide new important considerations for the design and characterisation of low-PIM printed circuits.",

author = "Alexey Shitvov and T. Olsson and J. Francey and Dmitry Zelenchuk and Alexander Schuchinsky and {El Banna}, B.",

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AU - Shitvov, Alexey

AU - Olsson, T.

AU - Francey, J.

AU - Zelenchuk, Dmitry

AU - Schuchinsky, Alexander

AU - El Banna, B.

PY - 2011/1

Y1 - 2011/1

N2 - An experimental investigation of the effect of conductor-to-substrate interface on distributed passive intermodulation (PIM) generation in printed microstrip lines has been undertaken using the custom-designed microwave laminates with removed surface bonding layers and with the commercial adhesion promotion applied to the conductor underside. The study of long-term stability of PIM performance of the printed circuits is reported for the first time. The comprehensive measurement results, observations of the selfimprovement of the PIM performance and the effect of panel bending on PIM generation in printed boards with different finishing are presented. A consistent physical interpretation of the observed phenomena is proposed. The results of this study provide new important considerations for the design and characterisation of low-PIM printed circuits.

AB - An experimental investigation of the effect of conductor-to-substrate interface on distributed passive intermodulation (PIM) generation in printed microstrip lines has been undertaken using the custom-designed microwave laminates with removed surface bonding layers and with the commercial adhesion promotion applied to the conductor underside. The study of long-term stability of PIM performance of the printed circuits is reported for the first time. The comprehensive measurement results, observations of the selfimprovement of the PIM performance and the effect of panel bending on PIM generation in printed boards with different finishing are presented. A consistent physical interpretation of the observed phenomena is proposed. The results of this study provide new important considerations for the design and characterisation of low-PIM printed circuits.

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DO - 10.1049/iet-map.2010.0070

M3 - Article

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SP - 68

EP - 76

JO - IET Microwaves, Antennas and Propagation

JF - IET Microwaves, Antennas and Propagation

SN - 1751-8725

IS - 1

ER -

Effects of Interface Conditions and Long-Term Stability of Passive Intermodulation Response in Printed Lines

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