Experimental study of the voids in the electroless copper deposits and the direct measurement of the void fraction based on the scanning electron microscopy images

X. Wu; Wei Sha

Experimental study of the voids in the electroless copper deposits and the direct measurement of the void fraction based on the scanning electron microscopy images

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	4259-4266
Number of pages	8
Journal	Applied Surface Science
Volume	255
Issue number	7
Publication status	Published - 15 Jan 2009

ASJC Scopus subject areas

Surfaces, Coatings and Films

Cite this

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title = "Experimental study of the voids in the electroless copper deposits and the direct measurement of the void fraction based on the scanning electron microscopy images",

author = "X. Wu and Wei Sha",

year = "2009",

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day = "15",

language = "English",

volume = "255",

pages = "4259--4266",

journal = "Applied Surface Science",

publisher = "Elsevier B.V.",

number = "7",

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T1 - Experimental study of the voids in the electroless copper deposits and the direct measurement of the void fraction based on the scanning electron microscopy images

AU - Wu, X.

AU - Sha, Wei

PY - 2009/1/15

Y1 - 2009/1/15

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M3 - Article

VL - 255

SP - 4259

EP - 4266

JO - Applied Surface Science

JF - Applied Surface Science

IS - 7

ER -

Experimental study of the voids in the electroless copper deposits and the direct measurement of the void fraction based on the scanning electron microscopy images

ASJC Scopus subject areas

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