Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology

P.J. McNally, J. Kanatharana, B.H.W. Toh, David McNeill, A.N. Danilewsky, T. Tuomi, L. Knuuttila, J. Riikonen, J. Toivonen, R. Simon

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)
Original languageEnglish
Article number7
Pages (from-to)7596-7602
Number of pages7
JournalJournal of Applied Physics
Issue number12
Publication statusPublished - 15 Dec 2004

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)
  • Physics and Astronomy(all)

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