Hybrid FIB milling strategy for the fabrication of plasmonic nanostructures on semiconductor substrates

Joshua Einsle, Jean-Sebastien Bouillard, Wayne Dickson, Anatoly Zayats

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

The optical properties of plasmonic semiconductor devices fabricated by focused ion beam (FIB) milling deteriorate because of the amorphisation of the semiconductor substrate. This study explores the effects of combining traditional 30 kV FIB milling with 5 kV FIB patterning to minimise the semiconductor damage and at the same time maintain high spatial resolution. The use of reduced acceleration voltages is shown to reduce the damage from higher energy ions on the example of fabrication of plasmonic crystals on semiconductor substrates leading to 7-fold increase in transmission. This effect is important for focused-ion beam fabrication of plasmonic structures integrated with photodetectors, light-emitting diodes and semiconductor lasers.
Original languageEnglish
Article number572
Pages (from-to)1-5
Number of pages1
JournalNanoscale Research Letters
Volume6
Publication statusPublished - 31 Oct 2011

Keywords

  • FIB
  • Low-kV
  • High index of refraction
  • GaP

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

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