Identifying key process characteristics and predicting etch rate from High-Dimension Datasets

E. Ragnoli*, S. McLoone, S. Lynn, J. Ringwood, N. Macgearailt

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

16 Citations (Scopus)

Abstract

In semiconductor manufacturing advanced process control (APC) refers to a range of techniques that can be used to improve process capability. As the dimensions of electronic devices have decreased, the application of APC has become more and more important for the critical stages of production processes. However, the economic disadvantage of employing APC is that it requires feedback information in the form of downstream metrology data, which is both time consuming and costly to obtain.

Original languageEnglish
Title of host publication2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2009
Pages106-111
Number of pages6
DOIs
Publication statusPublished - 27 Oct 2009
Externally publishedYes
Event2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2009 - Berlin, Germany
Duration: 10 May 200912 May 2009

Conference

Conference2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2009
CountryGermany
CityBerlin
Period10/05/200912/05/2009

ASJC Scopus subject areas

  • Engineering(all)

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    Ragnoli, E., McLoone, S., Lynn, S., Ringwood, J., & Macgearailt, N. (2009). Identifying key process characteristics and predicting etch rate from High-Dimension Datasets. In 2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2009 (pp. 106-111). [5155966] https://doi.org/10.1109/ASMC.2009.5155966