Impact of buried oxide thickness and ground plane resistivity on substrate cross-talk in Ground Plane Silicon-on-Insulator (GPSOI) cross-talk suppression technology

Mervyn Armstrong; Michael Bain; Paul Baine; Harold Gamble

Impact of buried oxide thickness and ground plane resistivity on substrate cross-talk in Ground Plane Silicon-on-Insulator (GPSOI) cross-talk suppression technology

Mervyn Armstrong, Michael Bain, Paul Baine, Harold Gamble

School of Electronics, Electrical Engineering and Computer Science

Research output: Contribution to conference › Paper

Original language	English
Pages	84-85
Number of pages	2
Publication status	Published - Oct 2004
Event	Proceedings - IEEE Intl SOI Conf, Proceedings, p 84-85 - Charleston, United States Duration: 01 Oct 2004 → 01 Oct 2004

Conference

Conference	Proceedings - IEEE Intl SOI Conf, Proceedings, p 84-85
Country/Territory	United States
City	Charleston
Period	01/10/2004 → 01/10/2004

Cite this

@conference{ece1e7b4d52d4e939f31e9c0b641be7d,

title = "Impact of buried oxide thickness and ground plane resistivity on substrate cross-talk in Ground Plane Silicon-on-Insulator (GPSOI) cross-talk suppression technology",

author = "Mervyn Armstrong and Michael Bain and Paul Baine and Harold Gamble",

year = "2004",

month = oct,

language = "English",

pages = "84--85",

note = "Proceedings - IEEE Intl SOI Conf, Proceedings, p 84-85 ; Conference date: 01-10-2004 Through 01-10-2004",

}

Impact of buried oxide thickness and ground plane resistivity on substrate cross-talk in Ground Plane Silicon-on-Insulator (GPSOI) cross-talk suppression technology. / Armstrong, Mervyn; Bain, Michael; Baine, Paul et al.

2004. 84-85 Paper presented at Proceedings - IEEE Intl SOI Conf, Proceedings, p 84-85, Charleston, United States.

Research output: Contribution to conference › Paper

TY - CONF

T1 - Impact of buried oxide thickness and ground plane resistivity on substrate cross-talk in Ground Plane Silicon-on-Insulator (GPSOI) cross-talk suppression technology

AU - Armstrong, Mervyn

AU - Bain, Michael

AU - Baine, Paul

AU - Gamble, Harold

PY - 2004/10

Y1 - 2004/10

UR - http://www.scopus.com/inward/record.url?scp=16244406803&partnerID=8YFLogxK

M3 - Paper

SP - 84

EP - 85

T2 - Proceedings - IEEE Intl SOI Conf, Proceedings, p 84-85

Y2 - 1 October 2004 through 1 October 2004

ER -

Impact of buried oxide thickness and ground plane resistivity on substrate cross-talk in Ground Plane Silicon-on-Insulator (GPSOI) cross-talk suppression technology

Conference

Other files and links

Cite this