Integration of ultrathin SOI using ion split and etch back processes

Mervyn Armstrong, Paul Baine, Harold Gamble, David McNeill, Suli Suder

Research output: Contribution to conferencePaper

Original languageEnglish
Pages19-20
Number of pages2
Publication statusPublished - Jan 2007
EventProc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits - Leuven, Belgium
Duration: 01 Jan 200701 Jan 2007

Conference

ConferenceProc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits
CountryBelgium
CityLeuven
Period01/01/200701/01/2007

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