Integration of ultrathin SOI using ion split and etch back processes

Mervyn Armstrong, Paul Baine, Harold Gamble, David McNeill, Suli Suder

Research output: Contribution to conferencePaper

LanguageEnglish
Pages19-20
Number of pages2
Publication statusPublished - Jan 2007
EventProc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits - Leuven, Belgium
Duration: 01 Jan 200701 Jan 2007

Conference

ConferenceProc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits
CountryBelgium
CityLeuven
Period01/01/200701/01/2007

Cite this

Armstrong, M., Baine, P., Gamble, H., McNeill, D., & Suder, S. (2007). Integration of ultrathin SOI using ion split and etch back processes. 19-20. Paper presented at Proc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits, Leuven, Belgium.
Armstrong, Mervyn ; Baine, Paul ; Gamble, Harold ; McNeill, David ; Suder, Suli. / Integration of ultrathin SOI using ion split and etch back processes. Paper presented at Proc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits, Leuven, Belgium.2 p.
@conference{2da0d87316ac4383ac50bd6f6ea651b2,
title = "Integration of ultrathin SOI using ion split and etch back processes",
author = "Mervyn Armstrong and Paul Baine and Harold Gamble and David McNeill and Suli Suder",
year = "2007",
month = "1",
language = "English",
pages = "19--20",
note = "Proc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits ; Conference date: 01-01-2007 Through 01-01-2007",

}

Armstrong, M, Baine, P, Gamble, H, McNeill, D & Suder, S 2007, 'Integration of ultrathin SOI using ion split and etch back processes' Paper presented at Proc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits, Leuven, Belgium, 01/01/2007 - 01/01/2007, pp. 19-20.

Integration of ultrathin SOI using ion split and etch back processes. / Armstrong, Mervyn; Baine, Paul; Gamble, Harold; McNeill, David; Suder, Suli.

2007. 19-20 Paper presented at Proc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits, Leuven, Belgium.

Research output: Contribution to conferencePaper

TY - CONF

T1 - Integration of ultrathin SOI using ion split and etch back processes

AU - Armstrong, Mervyn

AU - Baine, Paul

AU - Gamble, Harold

AU - McNeill, David

AU - Suder, Suli

PY - 2007/1

Y1 - 2007/1

M3 - Paper

SP - 19

EP - 20

ER -

Armstrong M, Baine P, Gamble H, McNeill D, Suder S. Integration of ultrathin SOI using ion split and etch back processes. 2007. Paper presented at Proc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits, Leuven, Belgium.