Integration of ultrathin SOI using ion split and etch back processes

Mervyn Armstrong; Paul Baine; Harold Gamble; David McNeill; Suli Suder

Integration of ultrathin SOI using ion split and etch back processes

Mervyn Armstrong, Paul Baine, Harold Gamble, David McNeill, Suli Suder

Research output: Contribution to conference › Paper

Original language	English
Pages	19-20
Number of pages	2
Publication status	Published - Jan 2007
Event	Proc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits - Leuven, Belgium Duration: 01 Jan 2007 → 01 Jan 2007

Conference

Conference	Proc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits
Country/Territory	Belgium
City	Leuven
Period	01/01/2007 → 01/01/2007

Cite this

@conference{2da0d87316ac4383ac50bd6f6ea651b2,

title = "Integration of ultrathin SOI using ion split and etch back processes",

author = "Mervyn Armstrong and Paul Baine and Harold Gamble and David McNeill and Suli Suder",

year = "2007",

month = jan,

language = "English",

pages = "19--20",

note = "Proc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits ; Conference date: 01-01-2007 Through 01-01-2007",

}

TY - CONF

T1 - Integration of ultrathin SOI using ion split and etch back processes

AU - Armstrong, Mervyn

AU - Baine, Paul

AU - Gamble, Harold

AU - McNeill, David

AU - Suder, Suli

PY - 2007/1

Y1 - 2007/1

M3 - Paper

SP - 19

EP - 20

T2 - Proc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits

Y2 - 1 January 2007 through 1 January 2007

ER -