Investigation of copper layers deposited by CVD using Cu(I)hfac(TMVS) precursor

B.H.W. Toh, David McNeill, Harold Gamble

Research output: Contribution to journalArticle

7 Citations (Scopus)
Original languageEnglish
Pages (from-to)437-443
Number of pages7
JournalJournal of Materials Science: Materials in Electronics
Volume16(7)
Issue number7
DOIs
Publication statusPublished - Jul 2005

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