Manufacture processes for GPSOI substrates and their influence on cross-talk suppression

Paul Baine; Harold Gamble; Mervyn Armstrong; David McNeill; Michael Bain; J.S. Hamel; M. Kraft

Manufacture processes for GPSOI substrates and their influence on cross-talk suppression

Paul Baine, Harold Gamble, Mervyn Armstrong, David McNeill, Michael Bain, J.S. Hamel, M. Kraft

Research output: Contribution to conference › Paper

Original language	English
Pages	57-63
Number of pages	7
Publication status	Published - Apr 2003
Event	Electrochemical Society Proc, Semiconductor Wafer Bonding VII, Science Technology and Applications - Proc of the Intl Symposium - Paris, France Duration: 01 Apr 2003 → 01 Apr 2003

Conference

Conference	Electrochemical Society Proc, Semiconductor Wafer Bonding VII, Science Technology and Applications - Proc of the Intl Symposium
Country/Territory	France
City	Paris
Period	01/04/2003 → 01/04/2003

Cite this

@conference{7d6d1a922bb9457ab3aab9b57b8a43f0,

title = "Manufacture processes for GPSOI substrates and their influence on cross-talk suppression",

author = "Paul Baine and Harold Gamble and Mervyn Armstrong and David McNeill and Michael Bain and J.S. Hamel and M. Kraft",

year = "2003",

month = apr,

language = "English",

pages = "57--63",

note = "Electrochemical Society Proc, Semiconductor Wafer Bonding VII, Science Technology and Applications - Proc of the Intl Symposium ; Conference date: 01-04-2003 Through 01-04-2003",

}

Baine, P, Gamble, H, Armstrong, M , McNeill, D, Bain, M, Hamel, JS & Kraft, M 2003, 'Manufacture processes for GPSOI substrates and their influence on cross-talk suppression', Paper presented at Electrochemical Society Proc, Semiconductor Wafer Bonding VII, Science Technology and Applications - Proc of the Intl Symposium, Paris, France, 01/04/2003 - 01/04/2003 pp. 57-63.

Manufacture processes for GPSOI substrates and their influence on cross-talk suppression. / Baine, Paul; Gamble, Harold; Armstrong, Mervyn et al.
2003. 57-63 Paper presented at Electrochemical Society Proc, Semiconductor Wafer Bonding VII, Science Technology and Applications - Proc of the Intl Symposium, Paris, France.

Research output: Contribution to conference › Paper

TY - CONF

T1 - Manufacture processes for GPSOI substrates and their influence on cross-talk suppression

AU - Baine, Paul

AU - Gamble, Harold

AU - Armstrong, Mervyn

AU - McNeill, David

AU - Bain, Michael

AU - Hamel, J.S.

AU - Kraft, M.

PY - 2003/4

Y1 - 2003/4

M3 - Paper

SP - 57

EP - 63

T2 - Electrochemical Society Proc, Semiconductor Wafer Bonding VII, Science Technology and Applications - Proc of the Intl Symposium

Y2 - 1 April 2003 through 1 April 2003

ER -