Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance

Mervyn Armstrong; Michael Bain; Paul Baine; Harold Gamble; David McNeill

Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance

Mervyn Armstrong, Michael Bain, Paul Baine, Harold Gamble, David McNeill

Research output: Contribution to conference › Paper

Original language	English
Number of pages	7
Publication status	Published - Sep 2003
Event	Electrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications - Paris, France Duration: 01 Sep 2003 → 01 Sep 2003

Conference

Conference	Electrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications
Country	France
City	Paris
Period	01/09/2003 → 01/09/2003

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Link to publication in Scopus

Cite this

@conference{940940a333c9419ab74fae38a20014ba,

title = "Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance",

author = "Mervyn Armstrong and Michael Bain and Paul Baine and Harold Gamble and David McNeill",

year = "2003",

month = sep,

language = "English",

note = "Electrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications ; Conference date: 01-09-2003 Through 01-09-2003",

}

Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance. / Armstrong, Mervyn; Bain, Michael; Baine, Paul; Gamble, Harold; McNeill, David.

2003. Paper presented at Electrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications, Paris, France.

Research output: Contribution to conference › Paper

TY - CONF

T1 - Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance

AU - Armstrong, Mervyn

AU - Bain, Michael

AU - Baine, Paul

AU - Gamble, Harold

AU - McNeill, David

PY - 2003/9

Y1 - 2003/9

UR - http://www.scopus.com/inward/record.url?scp=3042696436&partnerID=8YFLogxK

M3 - Paper

T2 - Electrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications

Y2 - 1 September 2003 through 1 September 2003

ER -