Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance

Mervyn Armstrong, Michael Bain, Paul Baine, Harold Gamble, David McNeill

Research output: Contribution to conferencePaper

LanguageEnglish
Number of pages7
Publication statusPublished - Sep 2003
EventElectrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications - Paris, France
Duration: 01 Sep 200301 Sep 2003

Conference

ConferenceElectrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications
CountryFrance
CityParis
Period01/09/200301/09/2003

Cite this

Armstrong, M., Bain, M., Baine, P., Gamble, H., & McNeill, D. (2003). Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance. Paper presented at Electrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications, Paris, France.
Armstrong, Mervyn ; Bain, Michael ; Baine, Paul ; Gamble, Harold ; McNeill, David. / Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance. Paper presented at Electrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications, Paris, France.7 p.
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note = "Electrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications ; Conference date: 01-09-2003 Through 01-09-2003",

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Armstrong, M, Bain, M, Baine, P, Gamble, H & McNeill, D 2003, 'Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance' Paper presented at Electrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications, Paris, France, 01/09/2003 - 01/09/2003, .

Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance. / Armstrong, Mervyn; Bain, Michael; Baine, Paul; Gamble, Harold; McNeill, David.

2003. Paper presented at Electrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications, Paris, France.

Research output: Contribution to conferencePaper

TY - CONF

T1 - Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance

AU - Armstrong, Mervyn

AU - Bain, Michael

AU - Baine, Paul

AU - Gamble, Harold

AU - McNeill, David

PY - 2003/9

Y1 - 2003/9

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M3 - Paper

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Armstrong M, Bain M, Baine P, Gamble H, McNeill D. Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance. 2003. Paper presented at Electrochemical Society Proc, v 19, Semiconductor Wafer Bonding VII: Science, Technology, & Applications, Paris, France.