Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance

Paul Baine, Harold Gamble, Mervyn Armstrong, Michael Bain, David McNeill, J. Hamel, S. Stefanos, M. Kraft

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - Apr 2003
Event7th International Symposium on Semiconductor Wafer Bonding - Paris, France
Duration: 01 Apr 200301 Apr 2003

Conference

Conference7th International Symposium on Semiconductor Wafer Bonding
CountryFrance
CityParis
Period01/04/200301/04/2003

Cite this

Baine, P., Gamble, H., Armstrong, M., Bain, M., McNeill, D., Hamel, J., ... Kraft, M. (2003). Manufacturing processes for WSi2-GPSOI substrates and their influence on cross-talk suppression and inductance. Paper presented at 7th International Symposium on Semiconductor Wafer Bonding, Paris, France.