Microwave curing of materials for high density packaging

George Goussetis, K.I. Sinclair, A.J. Sangster, M.P.Y. Desmulliez, T. Tilford, A.K. Parrott, C. Bailey

Research output: Contribution to conferencePaper

Original languageEnglish
Pages30-30
Number of pages1
Publication statusPublished - Jun 2007
EventInternational Symposium on High Density Packaging and Microsystems Integration - Shanghai, China
Duration: 01 Jun 200701 Jun 2007

Conference

ConferenceInternational Symposium on High Density Packaging and Microsystems Integration
CountryChina
CityShanghai
Period01/06/200701/06/2007

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