Microwave curing of materials for high density packaging

George Goussetis, K.I. Sinclair, A.J. Sangster, M.P.Y. Desmulliez, T. Tilford, A.K. Parrott, C. Bailey

Research output: Contribution to conference › Paper

Original language	English
Pages	30-30
Number of pages	1
Publication status	Published - Jun 2007
Event	International Symposium on High Density Packaging and Microsystems Integration - Shanghai, China Duration: 01 Jun 2007 → 01 Jun 2007

Conference	International Symposium on High Density Packaging and Microsystems Integration
Country/Territory	China
City	Shanghai
Period	01/06/2007 → 01/06/2007

Cite this

@conference{4401b59e30364ab19e8b067a797ece94,

title = "Microwave curing of materials for high density packaging",

author = "George Goussetis and K.I. Sinclair and A.J. Sangster and M.P.Y. Desmulliez and T. Tilford and A.K. Parrott and C. Bailey",

year = "2007",

month = jun,

language = "English",

pages = "30--30",

note = "International Symposium on High Density Packaging and Microsystems Integration ; Conference date: 01-06-2007 Through 01-06-2007",

}

TY - CONF

T1 - Microwave curing of materials for high density packaging

AU - Goussetis, George

AU - Sinclair, K.I.

AU - Sangster, A.J.

AU - Desmulliez, M.P.Y.

AU - Tilford, T.

AU - Parrott, A.K.

AU - Bailey, C.

PY - 2007/6

Y1 - 2007/6

UR - http://www.scopus.com/inward/record.url?scp=40949166265&partnerID=8YFLogxK

M3 - Paper

SP - 30

EP - 30

T2 - International Symposium on High Density Packaging and Microsystems Integration

Y2 - 1 June 2007 through 1 June 2007

ER -