Multiobjective design optimization of IGBT power modules considering power cycling and thermal cycling

Bing Ji, Xueguan Song, Edward Sciberras, Wenping Cao, Yihua Hu, Volker Pickert

Research output: Contribution to journalArticlepeer-review

61 Citations (Scopus)
587 Downloads (Pure)

Abstract

Insulated-gate bipolar transistor (IGBT) power modules find widespread use in numerous power conversion applications where their reliability is of significant concern. Standard IGBT modules are fabricated for general-purpose applications while little has been designed for bespoke applications. However, conventional design of IGBTs can be improved by the multiobjective optimization technique. This paper proposes a novel design method to consider die-attachment solder failures induced by short power cycling and baseplate solder fatigue induced by the thermal cycling which are among major failure mechanisms of IGBTs. Thermal resistance is calculated analytically and the plastic work design is obtained with a high-fidelity finite-element model, which has been validated experimentally. The objective of minimizing the plastic work and constrain functions is formulated by the surrogate model. The nondominated sorting genetic algorithm-II is used to search for the Pareto-optimal solutions and the best design. The result of this combination generates an effective approach to optimize the physical structure of power electronic modules, taking account of historical environmental and operational conditions in the field.

Original languageEnglish
Pages (from-to)2493-2504
Number of pages12
JournalIEEE Transactions on Power Electronics
Volume30
Issue number5
DOIs
Publication statusPublished - 01 May 2015

Keywords

  • Aging
  • fatigue
  • finite-element (FE) methods
  • insulated-gate bipolar transistors (IGBTs)
  • multiobjective
  • optimization methods
  • power cycling (PC)
  • reliability
  • thermal cycling (TC)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Multiobjective design optimization of IGBT power modules considering power cycling and thermal cycling'. Together they form a unique fingerprint.

Cite this