Novel and simple creep testing method and its application in measuring the creep of solder

Wei Sha*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

A simple creep testing method is presented which involves using coiled specimens. With this method, a single experiment can give all the data required for a plot of strain rate versus stress. The value of the stress-exponent of room temperature steady-state creep a Pb-61.5wt% Sn solder was measured in this way to be 1.06, as expected from a diffusion creep mechanism.

Original languageEnglish
Pages (from-to)106-109
Number of pages4
JournalRare Metals
Volume15
Issue number2
Publication statusPublished - 01 Apr 1996

ASJC Scopus subject areas

  • Materials Science(all)
  • Metals and Alloys

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