A simple creep testing method is presented which involves using coiled specimens. With this method, a single experiment can give all the data required for a plot of strain rate versus stress. The value of the stress-exponent of room temperature steady-state creep a Pb-61.5wt% Sn solder was measured in this way to be 1.06, as expected from a diffusion creep mechanism.
|Number of pages||4|
|Publication status||Published - 01 Apr 1996|
ASJC Scopus subject areas
- Materials Science(all)
- Metals and Alloys