Novel and simple creep testing method and its application in measuring the creep of solder

Wei Sha

Novel and simple creep testing method and its application in measuring the creep of solder

Wei Sha^*

^*Corresponding author for this work

Queen's University Belfast

Research output: Contribution to journal › Article › peer-review

Abstract

A simple creep testing method is presented which involves using coiled specimens. With this method, a single experiment can give all the data required for a plot of strain rate versus stress. The value of the stress-exponent of room temperature steady-state creep a Pb-61.5wt% Sn solder was measured in this way to be 1.06, as expected from a diffusion creep mechanism.

Original language	English
Pages (from-to)	106-109
Number of pages	4
Journal	Rare Metals
Volume	15
Issue number	2
Publication status	Published - 01 Apr 1996

ASJC Scopus subject areas

General Materials Science
Metals and Alloys

Cite this

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abstract = "A simple creep testing method is presented which involves using coiled specimens. With this method, a single experiment can give all the data required for a plot of strain rate versus stress. The value of the stress-exponent of room temperature steady-state creep a Pb-61.5wt\% Sn solder was measured in this way to be 1.06, as expected from a diffusion creep mechanism.",

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AB - A simple creep testing method is presented which involves using coiled specimens. With this method, a single experiment can give all the data required for a plot of strain rate versus stress. The value of the stress-exponent of room temperature steady-state creep a Pb-61.5wt% Sn solder was measured in this way to be 1.06, as expected from a diffusion creep mechanism.

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M3 - Article

AN - SCOPUS:0030122605

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Novel and simple creep testing method and its application in measuring the creep of solder

Abstract

ASJC Scopus subject areas

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