Novel materials for thermal via incorporation into SOI structures

Paul Baine, K.Y. Choon, Harold Gamble, Mervyn Armstrong, Neil Mitchell

Research output: Contribution to journalArticle

2 Citations (Scopus)
Original languageEnglish
Pages (from-to)215-218
Number of pages4
JournalJournal of Materials Science: Materials in Electronics
Volume12(4/6)
Issue number4-6
DOIs
Publication statusPublished - Jun 2001

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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