Novel materials for thermal via incorporation into SOI structures

Paul Baine, K.Y. Choon, Harold Gamble, Mervyn Armstrong, Neil Mitchell

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - Oct 2000
Event3rd International Conference on Materials in Microelectronics - Dublin, Ireland
Duration: 01 Oct 200101 Oct 2001

Conference

Conference3rd International Conference on Materials in Microelectronics
CountryIreland
CityDublin
Period01/10/200101/10/2001

Cite this

Baine, P., Choon, K. Y., Gamble, H., Armstrong, M., & Mitchell, N. (2000). Novel materials for thermal via incorporation into SOI structures. Paper presented at 3rd International Conference on Materials in Microelectronics, Dublin, Ireland.