Numerical Analysis of Thermal Stresses Induced During VFM Encapsulant Curing

T. Tilford, K.I. Sinclair, George Goussetis, C. Bailey, M.P.Y. Desmulliez, A.K. Parrott, A.J. Sangster

Research output: Contribution to conference › Paper

Original language	English
Pages	348-353
Number of pages	6
Publication status	Published - May 2008
Event	31st International Spring Seminar on Electronics Technology - Budapest, Hungary Duration: 01 May 2008 → 01 May 2008

Conference	31st International Spring Seminar on Electronics Technology
Country/Territory	Hungary
City	Budapest
Period	01/05/2008 → 01/05/2008

Cite this

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title = "Numerical Analysis of Thermal Stresses Induced During VFM Encapsulant Curing",

author = "T. Tilford and K.I. Sinclair and George Goussetis and C. Bailey and M.P.Y. Desmulliez and A.K. Parrott and A.J. Sangster",

year = "2008",

month = may,

language = "English",

pages = "348--353",

note = "31st International Spring Seminar on Electronics Technology ; Conference date: 01-05-2008 Through 01-05-2008",

}

TY - CONF

T1 - Numerical Analysis of Thermal Stresses Induced During VFM Encapsulant Curing

AU - Tilford, T.

AU - Sinclair, K.I.

AU - Goussetis, George

AU - Bailey, C.

AU - Desmulliez, M.P.Y.

AU - Parrott, A.K.

AU - Sangster, A.J.

PY - 2008/5

Y1 - 2008/5

UR - http://www.scopus.com/inward/record.url?scp=71249125753&partnerID=8YFLogxK

M3 - Paper

SP - 348

EP - 353

T2 - 31st International Spring Seminar on Electronics Technology

Y2 - 1 May 2008 through 1 May 2008

ER -