Numerical Analysis of Thermal Stresses Induced During VFM Encapsulant Curing

T. Tilford, K.I. Sinclair, George Goussetis, C. Bailey, M.P.Y. Desmulliez, A.K. Parrott, A.J. Sangster

Research output: Contribution to conferencePaper

Original languageEnglish
Pages348-353
Number of pages6
Publication statusPublished - May 2008
Event31st International Spring Seminar on Electronics Technology - Budapest, Hungary
Duration: 01 May 200801 May 2008

Conference

Conference31st International Spring Seminar on Electronics Technology
CountryHungary
CityBudapest
Period01/05/200801/05/2008

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