Open-ended microwave oven for flip-chip assembly

A.J. Sangster, K.I. Sinclair, M.P.Y. Desmulliez, George Goussetis

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

A novel open-ended waveguide cavity resonator for the microwave curing of bumps, underfills and encapsulants is described. The open oven has the potential to provide fast alignment of devices during flip-chip assembly, direct chip attach, surface mount assembly or wafer-scale level packaging. The prototype microwave oven was designed to operate at X-band for ease of testing, although a higher frequency version is planned. The device described in the paper takes the form of a waveguide cavity resonator. It is approximately square in cross-section and is filled with a low-loss dielectric with a relative permittivity of 6. It is excited by end-fed probes in order to couple power preferentially into the TM3,3,k mode with the object of forming nine 'hot-spots' in the open end. Low power tests using heat sensitive film demonstrate clearly that selective heating in multiple locations in the open end of the oven is achievable.
Original languageEnglish
Pages (from-to)53-58
Number of pages6
JournalIET MICROWAVES ANTENNAS & PROPAGATION
Volume2
Issue number1
DOIs
Publication statusPublished - 2008

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Sangster, A. J., Sinclair, K. I., Desmulliez, M. P. Y., & Goussetis, G. (2008). Open-ended microwave oven for flip-chip assembly. IET MICROWAVES ANTENNAS & PROPAGATION, 2(1), 53-58. https://doi.org/10.1049/iet-map:20060316