Open Ended Microwave Oven for Packaging

K.I. Sinclair, T. Tilford, M.Y.P. Desmulliez, George Goussetis, C. Bailey, K. Parrott, A.J. Sangster

Research output: Contribution to conference › Paper

Original language	English
Pages	16-20
Number of pages	5
Publication status	Published - Apr 2008
Event	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Nice, France Duration: 01 Apr 2008 → 01 Apr 2008

Conference	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Country/Territory	France
City	Nice
Period	01/04/2008 → 01/04/2008

Cite this

@conference{3f6533c89117478abcdfeb939c1573eb,

title = "Open Ended Microwave Oven for Packaging",

author = "K.I. Sinclair and T. Tilford and M.Y.P. Desmulliez and George Goussetis and C. Bailey and K. Parrott and A.J. Sangster",

year = "2008",

month = apr,

language = "English",

pages = "16--20",

note = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS ; Conference date: 01-04-2008 Through 01-04-2008",

}

TY - CONF

T1 - Open Ended Microwave Oven for Packaging

AU - Sinclair, K.I.

AU - Tilford, T.

AU - Desmulliez, M.Y.P.

AU - Goussetis, George

AU - Bailey, C.

AU - Parrott, K.

AU - Sangster, A.J.

PY - 2008/4

Y1 - 2008/4

UR - http://www.scopus.com/inward/record.url?scp=58149093633&partnerID=8YFLogxK

M3 - Paper

SP - 16

EP - 20

T2 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Y2 - 1 April 2008 through 1 April 2008

ER -