Optimization of an open-ended microwave oven for microelectronics packaging

K.I. Sinclair, George Goussetis, M.P.Y. Desmulliez, A.J. Sangster, T. Tilford, C. Bailey, A.K. Parrott

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

A physically open, but electrically shielded, microwave open oven can be produced by virtue of the evanescent fields in a waveguide below cutoff. The below cutoff heating chamber is fed by a transverse magnetic resonance established in a dielectric-filled section of the waveguide exploiting continuity of normal electric flux. In order to optimize the fields and the performance of the oven, a thin layer of a dielectric material with higher permittivity is inserted at the interface. Analysis and synthesis of an optimized open oven predicts field enhancement in the heating chamber up to 9.4 dB. Results from experimental testing on two fabricated prototypes are in agreement with the simulated predictions, and demonstrate an up to tenfold improvement in the heating performance. The open-ended oven allows for simultaneous precision alignment, testing, and efficient curing of microelectronic devices, significantly increasing productivity gains.
Original languageEnglish
Article number4657397
Pages (from-to)2635-2641
Number of pages7
JournalIEEE Transactions on Microwave Theory and Techniques
Volume56
Issue number11
DOIs
Publication statusPublished - Nov 2008

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Microwave ovens
ovens
Ovens
packaging
microelectronics
Microelectronics
Packaging
microwaves
optimization
Heating
heating
Waveguides
cut-off
chambers
waveguides
Evanescent fields
Testing
Magnetic resonance
curing
productivity

Cite this

Sinclair, K. I., Goussetis, G., Desmulliez, M. P. Y., Sangster, A. J., Tilford, T., Bailey, C., & Parrott, A. K. (2008). Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56(11), 2635-2641. [4657397]. https://doi.org/10.1109/TMTT.2008.2005925
Sinclair, K.I. ; Goussetis, George ; Desmulliez, M.P.Y. ; Sangster, A.J. ; Tilford, T. ; Bailey, C. ; Parrott, A.K. / Optimization of an open-ended microwave oven for microelectronics packaging. In: IEEE Transactions on Microwave Theory and Techniques. 2008 ; Vol. 56, No. 11. pp. 2635-2641.
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Sinclair, KI, Goussetis, G, Desmulliez, MPY, Sangster, AJ, Tilford, T, Bailey, C & Parrott, AK 2008, 'Optimization of an open-ended microwave oven for microelectronics packaging', IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 11, 4657397, pp. 2635-2641. https://doi.org/10.1109/TMTT.2008.2005925

Optimization of an open-ended microwave oven for microelectronics packaging. / Sinclair, K.I.; Goussetis, George; Desmulliez, M.P.Y.; Sangster, A.J.; Tilford, T.; Bailey, C.; Parrott, A.K.

In: IEEE Transactions on Microwave Theory and Techniques, Vol. 56, No. 11, 4657397, 11.2008, p. 2635-2641.

Research output: Contribution to journalArticle

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Sinclair KI, Goussetis G, Desmulliez MPY, Sangster AJ, Tilford T, Bailey C et al. Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques. 2008 Nov;56(11):2635-2641. 4657397. https://doi.org/10.1109/TMTT.2008.2005925