Plasma Etch Process Virtual Metrology using Aggregative Linear Regression

Research output: Contribution to conference › Paper › peer-review

Original language	English
Publication status	Published - 2011
Event	Third International Conference of Soft Computing and Pattern Recognition (SocPaR 2011) - Dalian, China Duration: 14 Oct 2011 → 16 Oct 2011

Conference	Third International Conference of Soft Computing and Pattern Recognition (SocPaR 2011)
Country/Territory	China
City	Dalian
Period	14/10/2011 → 16/10/2011

Cite this

@conference{01d8e493f7964a9bb90cc6625415e99a,

title = "Plasma Etch Process Virtual Metrology using Aggregative Linear Regression",

author = "Prakash, \{P. K S\} and Se{\'a}n McLoone",

year = "2011",

language = "English",

note = "Third International Conference of Soft Computing and Pattern Recognition (SocPaR 2011) ; Conference date: 14-10-2011 Through 16-10-2011",

}