Plug materials for thermoforming: The effects of non-isothermal plug contact.

Peter Martin, Hui Choo, C.Y. Cheong, Eileen Harkin-Jones

Research output: Contribution to conferencePaper

3 Citations (Scopus)
Original languageEnglish
Publication statusPublished - Jun 2009
EventANTEC 2009 Int Conf, The Society of Plastics Engineers - Chicago, United States
Duration: 01 Jun 200901 Jun 2009

Conference

ConferenceANTEC 2009 Int Conf, The Society of Plastics Engineers
CountryUnited States
CityChicago
Period01/06/200901/06/2009

Cite this

Martin, P., Choo, H., Cheong, C. Y., & Harkin-Jones, E. (2009). Plug materials for thermoforming: The effects of non-isothermal plug contact.. Paper presented at ANTEC 2009 Int Conf, The Society of Plastics Engineers, Chicago, United States.