Porous Silicon as a sacrificial layer in Production of Silicon Diaphragms by Precision Grinding

A. Prochaska, Neil Mitchell, Harold Gamble

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Original language	English
Title of host publication	Materials & Process Integration for MEMS
Editors	Francis E.H. Tay
Publisher	Springer
Pages	27-50
Number of pages	24
Publication status	Published - Aug 2002
Event	International MEMS Workshop - Singapore, Singapore Duration: 01 Jul 2002 → 01 Jul 2002

Conference	International MEMS Workshop
Country/Territory	Singapore
City	Singapore
Period	01/07/2002 → 01/07/2002

Chapter Number: 2

Cite this

@inbook{49d8db15e4a54c4db66f61d6593086c5,

title = "Porous Silicon as a sacrificial layer in Production of Silicon Diaphragms by Precision Grinding",

author = "A. Prochaska and Neil Mitchell and Harold Gamble",

note = "Chapter Number: 2; International MEMS Workshop ; Conference date: 01-07-2002 Through 01-07-2002",

year = "2002",

month = aug,

language = "English",

pages = "27--50",

editor = "Tay, {Francis E.H.}",

booktitle = "Materials & Process Integration for MEMS",

publisher = "Springer",

}

TY - CHAP

T1 - Porous Silicon as a sacrificial layer in Production of Silicon Diaphragms by Precision Grinding

AU - Prochaska, A.

AU - Mitchell, Neil

AU - Gamble, Harold

N1 - Chapter Number: 2

PY - 2002/8

Y1 - 2002/8

M3 - Chapter

SP - 27

EP - 50

BT - Materials & Process Integration for MEMS

A2 - Tay, Francis E.H.

PB - Springer

T2 - International MEMS Workshop

Y2 - 1 July 2002 through 1 July 2002

ER -