Production of diaphragms over a cavity by grinding to reduce wafer thickness

Harold Gamble (Inventor), Neil Mitchell (Inventor), A. Prochaska (Inventor), S.P. Fitzgerald (Inventor)

Research output: Patent

Original languageEnglish
Patent numberUS Patent 6,551,851
Publication statusPublished - Apr 2003

Cite this

Gamble, H., Mitchell, N., Prochaska, A., & Fitzgerald, S. P. (2003). Production of diaphragms over a cavity by grinding to reduce wafer thickness. (Patent No. US Patent 6,551,851).