Self-healing of cracks during ductile regime machining of silicon: Insights from molecular dynamics simulation

Saurav Goel, Alexander Stukowski, Andrii Kovalchenko, Graham Cross

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)
80 Downloads (Pure)


During nanoindentation and ductile-regime machining of silicon, a phenomenon known as “self-healing” takes place in that the microcracks, microfractures, and small spallings generated during the machining are filled by the plastically flowing ductile phase of silicon. However, this phenomenon has not been observed in simulation studies. In this work, using a long-range potential function, molecular dynamics simulation was used to provide an improved explanation of this mechanism. A unique phenomenon of brittle cracking was discovered, typically inclined at an angle of 45° to 55° to the cut surface, leading to the formation of periodic arrays of nanogrooves being filled by plastically flowing silicon during cutting. This observation is supported by the direct imaging. The simulated X-ray diffraction analysis proves that in contrast to experiments, Si-I to Si-II (beta tin) transformation during ductile-regime cutting is highly unlikely and solid-state amorphisation of silicon caused solely by the machining stress rather than the cutting temperature is the key to its brittle-ductile transition observed during the MD simulations
Original languageEnglish
Title of host publicationConference Proceedings 16th International Conference & Exhibition, Monday 30th May to Friday 3rd June 2016 University of Nottingham, UK
EditorsP. Bointon, R. Leach, N. Souton
Place of PublicationNottingham UK
Number of pages2
Publication statusPublished - 30 May 2016
Event16th EUSPEN International Conference and Exhibition - East Midlands Conference Centre, Nottingham, United Kingdom
Duration: 30 May 201603 Jun 2016


Conference16th EUSPEN International Conference and Exhibition
CountryUnited Kingdom
Internet address

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