Silicon-on-insulator substrates with buried tungsten silicide layer

Harold Gamble; Mervyn Armstrong; Paul Baine; Michael Bain; David McNeill

doi:10.1016/S0038-1101(01)00075-2

Silicon-on-insulator substrates with buried tungsten silicide layer

Harold Gamble
, Mervyn Armstrong
, Paul Baine
, Michael Bain
, David McNeill

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	551-557
Number of pages	7
Journal	Solid State Electronics
Volume	45(4)
Issue number	4
DOIs	https://doi.org/10.1016/S0038-1101(01)00075-2
Publication status	Published - Apr 2001

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Condensed Matter Physics

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10.1016/S0038-1101(01)00075-2

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@article{64923c5423a5413bab2820b1b7914707,

title = "Silicon-on-insulator substrates with buried tungsten silicide layer",

author = "Harold Gamble and Mervyn Armstrong and Paul Baine and Michael Bain and David McNeill",

year = "2001",

month = apr,

doi = "10.1016/S0038-1101(01)00075-2",

language = "English",

volume = "45(4)",

pages = "551--557",

journal = "Solid State Electronics",

issn = "0038-1101",

publisher = "Elsevier Ltd",

number = "4",

}

TY - JOUR

T1 - Silicon-on-insulator substrates with buried tungsten silicide layer

AU - Gamble, Harold

AU - Armstrong, Mervyn

AU - Baine, Paul

AU - Bain, Michael

AU - McNeill, David

PY - 2001/4

Y1 - 2001/4

UR - https://www.scopus.com/pages/publications/0035335811

U2 - 10.1016/S0038-1101(01)00075-2

DO - 10.1016/S0038-1101(01)00075-2

M3 - Article

SN - 0038-1101

VL - 45(4)

SP - 551

EP - 557

JO - Solid State Electronics

JF - Solid State Electronics

IS - 4

ER -

Silicon-on-insulator substrates with buried tungsten silicide layer

ASJC Scopus subject areas

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