Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon

Saurav Goel

Research output: Contribution to journalArticle

3 Citations (Scopus)
Original languageEnglish
JournalKey Engineering Materials
DOIs
Publication statusPublished - 2012

Cite this

@article{ecc9e3e04b504c26afe8ff19b1f38d7f,
title = "Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon",
author = "Saurav Goel",
year = "2012",
doi = "10.4028/www.scientific.net/KEM.496.223",
language = "English",
journal = "Key Engineering Materials",
issn = "1013-9826",
publisher = "Trans Tech Publications",

}

TY - JOUR

T1 - Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon

AU - Goel, Saurav

PY - 2012

Y1 - 2012

U2 - 10.4028/www.scientific.net/KEM.496.223

DO - 10.4028/www.scientific.net/KEM.496.223

M3 - Article

JO - Key Engineering Materials

JF - Key Engineering Materials

SN - 1013-9826

ER -