Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Original language	English
Journal	Key Engineering Materials
DOIs	https://doi.org/10.4028/www.scientific.net/KEM.496.223
Publication status	Published - 2012

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@article{ecc9e3e04b504c26afe8ff19b1f38d7f,

title = "Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon",

author = "Saurav Goel",

year = "2012",

doi = "10.4028/www.scientific.net/KEM.496.223",

language = "English",

journal = "Key Engineering Materials",

issn = "1662-9795",

publisher = "Trans Tech Publications Ltd",

}