Abstract
The stress in polycrystalline silicon due to CoSi2 in the scale of μm in integrated circuit by micro-Raman spectroscopy has been studied. The results show that the stress induced by CoSi2 grown on the polycrystalline Si is compressive stress. Relations between the magnitude of the stress and the area of the CoSi2 films are studied. And it is found that smaller dimension of CoSi2 film causes larger stress, and the stress on the boundary of the CoSi2 patterns has contrary type to those at the center of the patterns and has twice absolute magnitude of that at the center of the patterns.
Original language | English |
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Pages (from-to) | 299-303 |
Number of pages | 5 |
Journal | Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors |
Volume | 19 |
Issue number | 4 |
Publication status | Published - 01 Dec 1998 |
Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry