Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding

Research output: Contribution to conference › Paper

Original language	English
Pages	0-0
Number of pages	1
Publication status	Published - Jun 2010
Event	UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010 - Belfast, United Kingdom Duration: 01 Jun 2010 → 01 Jun 2010

Conference	UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010
Country/Territory	United Kingdom
City	Belfast
Period	01/06/2010 → 01/06/2010

Cite this

@conference{9615118a5cd547cdb1b0fccbe19a4631,

title = "Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding",

author = "Y.W. Low and Harold Gamble and Mervyn Armstrong and Paul Rainey and Paul Baine and John Montgomery and Neil Mitchell and David McNeill",

year = "2010",

month = jun,

language = "English",

pages = "0--0",

note = "UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010 ; Conference date: 01-06-2010 Through 01-06-2010",

}

TY - CONF

T1 - Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding

AU - Low, Y.W.

AU - Gamble, Harold

AU - Armstrong, Mervyn

AU - Rainey, Paul

AU - Baine, Paul

AU - Montgomery, John

AU - Mitchell, Neil

AU - McNeill, David

PY - 2010/6

Y1 - 2010/6

M3 - Paper

SP - 0

EP - 0

T2 - UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010

Y2 - 1 June 2010 through 1 June 2010

ER -