Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding

Y.W. Low, Harold Gamble, Mervyn Armstrong, Paul Rainey, Paul Baine, John Montgomery, Neil Mitchell, David McNeill

Research output: Contribution to conferencePaper

Original languageEnglish
Pages0-0
Number of pages1
Publication statusPublished - Jun 2010
EventUK-Malaysia-Ireland Engineering Science Conference, UMIES 2010 - Belfast, United Kingdom
Duration: 01 Jun 201001 Jun 2010

Conference

ConferenceUK-Malaysia-Ireland Engineering Science Conference, UMIES 2010
CountryUnited Kingdom
CityBelfast
Period01/06/201001/06/2010

Cite this

Low, Y. W., Gamble, H., Armstrong, M., Rainey, P., Baine, P., Montgomery, J., Mitchell, N., & McNeill, D. (2010). Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding. 0-0. Paper presented at UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010, Belfast, United Kingdom.