Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding

Y.W. Low, Harold Gamble, Mervyn Armstrong, Paul Rainey, Paul Baine, John Montgomery, Neil Mitchell, David McNeill

Research output: Contribution to conferencePaper

LanguageEnglish
Pages0-0
Number of pages1
Publication statusPublished - Jun 2010
EventUK-Malaysia-Ireland Engineering Science Conference, UMIES 2010 - Belfast, United Kingdom
Duration: 01 Jun 201001 Jun 2010

Conference

ConferenceUK-Malaysia-Ireland Engineering Science Conference, UMIES 2010
CountryUnited Kingdom
CityBelfast
Period01/06/201001/06/2010

Cite this

Low, Y. W., Gamble, H., Armstrong, M., Rainey, P., Baine, P., Montgomery, J., ... McNeill, D. (2010). Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding. 0-0. Paper presented at UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010, Belfast, United Kingdom.
Low, Y.W. ; Gamble, Harold ; Armstrong, Mervyn ; Rainey, Paul ; Baine, Paul ; Montgomery, John ; Mitchell, Neil ; McNeill, David. / Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding. Paper presented at UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010, Belfast, United Kingdom.1 p.
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year = "2010",
month = "6",
language = "English",
pages = "0--0",
note = "UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010 ; Conference date: 01-06-2010 Through 01-06-2010",

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Low, YW, Gamble, H, Armstrong, M, Rainey, P, Baine, P, Montgomery, J, Mitchell, N & McNeill, D 2010, 'Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding' Paper presented at UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010, Belfast, United Kingdom, 01/06/2010 - 01/06/2010, pp. 0-0.

Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding. / Low, Y.W.; Gamble, Harold; Armstrong, Mervyn; Rainey, Paul; Baine, Paul; Montgomery, John; Mitchell, Neil; McNeill, David.

2010. 0-0 Paper presented at UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010, Belfast, United Kingdom.

Research output: Contribution to conferencePaper

TY - CONF

T1 - Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding

AU - Low, Y.W.

AU - Gamble, Harold

AU - Armstrong, Mervyn

AU - Rainey, Paul

AU - Baine, Paul

AU - Montgomery, John

AU - Mitchell, Neil

AU - McNeill, David

PY - 2010/6

Y1 - 2010/6

M3 - Paper

SP - 0

EP - 0

ER -

Low YW, Gamble H, Armstrong M, Rainey P, Baine P, Montgomery J et al. Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding. 2010. Paper presented at UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010, Belfast, United Kingdom.