Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding

Y.W. Low, Harold Gamble, Mervyn Armstrong, Paul Rainey, Paul Baine, John Montgomery, Neil Mitchell, David McNeill

Research output: Contribution to conference › Paper

Original language	English
Pages	0-0
Number of pages	1
Publication status	Published - Jun 2010
Event	UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010 - Belfast, United Kingdom Duration: 01 Jun 2010 → 01 Jun 2010

Conference	UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010
Country/Territory	United Kingdom
City	Belfast
Period	01/06/2010 → 01/06/2010

Cite this

@conference{9615118a5cd547cdb1b0fccbe19a4631,

title = "Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding",

author = "Y.W. Low and Harold Gamble and Mervyn Armstrong and Paul Rainey and Paul Baine and John Montgomery and Neil Mitchell and David McNeill",

year = "2010",

month = jun,

language = "English",

pages = "0--0",

note = "UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010 ; Conference date: 01-06-2010 Through 01-06-2010",

}

TY - CONF

T1 - Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding

AU - Low, Y.W.

AU - Gamble, Harold

AU - Armstrong, Mervyn

AU - Rainey, Paul

AU - Baine, Paul

AU - Montgomery, John

AU - Mitchell, Neil

AU - McNeill, David

PY - 2010/6

Y1 - 2010/6

M3 - Paper

SP - 0

EP - 0

T2 - UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010

Y2 - 1 June 2010 through 1 June 2010

ER -